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MADP-000235-10720T
Non-Magnetic MELF PIN Diode
Rev. V1
Features * Non-Magnetic Package Suitable for MRI
Applications
MELF Internal Construction
* Rectangular MELF SMQ Ceramic Package * Hermetically Sealed * RoHS Compliant* and 260C Reflow Compatible Description
The MADP-000235-10720T is a surface mountable PIN diode in a non-magnetic Metal Electrode Leadless Faced (MELF) package. MADP-000235-10720T incorporates M/A-COM's time proven HIPAX technology to produce a low inductance ceramic package with no ribbons or wires. The package utilizes M/A-COM's unique non- magnetic plating process that provides for a hermetically sealed package with extremely low permeability. Incorporated in the package is a passivated PIN diode chip that is full face bonded on both the cathode and anode to maximize the surface contact area for lower electrical and thermal resistance. The chip and package have been comprehensively characterized both electrically and mechanically to ensure repeatable and predictable performance.
Application
The MADP-000235-10720T is designed for circuit protection and tuning of RF coil designs in MRI applications. When connected in an anti-parallel configuration these PIN diodes provide protection from
Absolute Maximum Ratings1,2 @ 25C
Parameter Reverse Voltage Forward Current Absolute Maximum -35 V 1.5 A -55C to +150C -55C to +175C
Designed for Automated Assembly
This SMQ PIN diode has been designed for high volume tape and reel assembly. The rectangular package design provides for highly efficient automatic pick and place assembly techniques. The parallel flat surfaces are suitable for key jaw or vacuum pickup techniques. All solderable surfaces are tin plated and compatible with most reflow and vapor phase soldering methods.
Operating Temperature Storage Temperature
1. Exceeding these limits may cause permanent damage to the device. 2. Values will re-rate over temperature.
* Restrictions on Hazardous Substances, European Union Directive 2002/95/EC. 1
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 * Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, * India Tel: +91.80.43537383 * China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MADP-000235-10720T
Non-Magnetic MELF PIN Diode
Rev. V1
Electrical Specifications @ TAMB = +25C
Min.3 Max.4 Thermal Power Max. Min. Rev. Volt. Capacitance Series Res. Parallel Res. Resistance Dissipation Nom. Characteristics VR @ 10A Ct @ 10V Rs @ 10mA Rating RP @ 0V Carrier 5 I-Region f = 100MHz f = 100MHz Lifetime Width Volts pF C/W Watts S Mils 35 1.2 0.5 5K 20 7.5 0.3 0.4
Part Number
MADP-00023510720T Notes:
3. The minimum specified VR (Reverse Voltage) is sourced and the resultant reverse leakage current, Ir, is measured to be <10A.
4. Capacitance is specified at 1MHz.
5. Nominal carrier life time specified with diode biased at IF = +10mA , IREV = -6mA
Typical Non-Magnetic Performance
C o m pComparison of Magnetic m e n t v s vs.FHeField r M A 4 P 7 4 6 1 F - 1 0 7 2 T & M A 4 P 1 2 5 0 - 1 0 7 2 T D e v i c e s a r i s o n o f M a g n e t i c M o Moment H i l d f o for MA4PH235-1072T & MADP-000235-1072T
2 .5 0 E -0 2
2 .0 0 E -0 2 M A 4 P 1 2 5 0 - 1 0 7 2 M a g n e t ic MA4PH235-1072TT (magnetic)
Device Magnetic Moment (EMU)
1 .5 0 E -0 2
1 .0 0 E -0 2
5 .0 0 E -0 3
0 .0 0 E + 0 0
-5 .0 0 E -0 3
M A 4 P 7 4 6 1 F - 1 0 7 2 T N n - M a g n e t ic MADP-000235-1072To(non-magnetic)
-1 .0 0 E -0 2
-1 .5 0 E -0 2
-2 .0 0 E -0 2
-2 .5 0 E -0 2 -1 .0 E + 0 4
-8 .0 E + 0 3
-6 .0 E + 0 3
-4 .0 E + 0 3
-2 .0 E + 0 3
0 .0 E + 0 0
2 .0 E + 0 3
4 .0 E + 0 3
6 .0 E + 0 3
8 .0 E + 0 3
1 .0 E + 0 4
H F ie ld ( O e r s te a d s )
Magnetic Property Saturation Moment (EMU) @ H = HMAX Oersteads Remanance Moment (EMU)@ H = 0 Oersteads Coercivity (Oersteads)@ EMU = 0 Moment
2
MADP-000235-1072T 2.3 x E-4 4.2 x E-8 1
MA4PH235-1072T 2.1 x E-2 7.1 x E-3 59.2
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 * Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, * India Tel: +91.80.43537383 * China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MADP-000235-10720T
Non-Magnetic MELF PIN Diode
Rev. V1
Cleanliness and Storage
These devices should be handled and stored in a clean environment. Ends of the device are tin plated for greater solderability. Continuous exposure to high humidity (>80%) for extended periods may cause the surface to oxidize. Caution should be taken when storing devices for long periods.
ESD
These devices are susceptible to ESD and are rated Class 2, HBM.
General Handling
Device can be handled with tweezers or vacuum pickups and are suitable for use with automatic pick-andplace equipment.
MELF Assembly Recommendations
Devices may be soldered using standard 60Sn/40Pb or RoHS compliant solders. MELF devices are tin plated 50 M thick to ensure an optimum connection. For recommended Sn/Pb and RoHS soldering profiles See Application Note M538 on the M/A-COM website.
1072 Package Dimensions
Cathode
A
Circuit Pad Layout
B Solderable Surfaces
A
A
C
Size Inches (mm) Case Style
1072
B
C
B
A (sq) Min./Max.
0.080/0.095 (2.032/2.413)
B Min./Max.
0.115/0.135 (2.921/3.429)
C Min./Max.
0.008/0.030 (.203/.762)
Dimension A B C
All tolerances are .001" ( .025 mm).
Package Style 1072 inches mm 0.093 2.36 0.050 1.27 0.060 1.52
Ordering Information
(Diodes are available in tape and reel in quantities shown below)
Package Style 1072T Quantity 7" Reel 1500
Tape and reel information can be found on the M/A-COM website at http://www.macom.com/Application%20Notes/pdf/M513.pdf
3
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 * Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, * India Tel: +91.80.43537383 * China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.

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